The diamond bonding process plays a crucial role in the production of compact and purpose-adapted cutting segments.
The bonding matrix holds the diamond crystals firmly in place.
The matrix consists of:
Circular saw blades have cutting segments with a positive cutting angle (material chips are cut out).
In diamond saw blades, the diamond crystals in the bonding matrix create a negative cutting angle (the diamond crystals grind the material in the same way a chisel would).
The bonding mix always depends on the material being cut.
In other words, the composition of the bonding matrix substantially influences cutting performance and tool wear.
We have to distinguish between
Diamonds break out. This will significantly reduce productivity and decrease tool life.